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DiTEC

Foam Polishing Pads - Fine Cut

$19.95 CAD

$15.96 CAD

Selling fast
The Details

The DiTEC Foam Polishing Pads 2.0 are premium-quality red foam pads designed for fine cut corrections and finishing on modern paint types. Offering low cutting action and a high-gloss effect, these pads are perfect for final polishing stages. Built for use with dual-action (DA) oscillating machines, they ensure durability, efficient heat dissipation, and professional-grade results.

The DiTEC Foam Polishing Pads 2.0 are premium-quality red foam pads designed for fine cut corrections and finishing on modern paint types. Offering low cutting action and a high-gloss effect, these pads are perfect for final polishing stages. Built for use with dual-action (DA) oscillating machines, they ensure durability, efficient heat dissipation, and professional-grade results.

Key Features
  • Recommended for use in combination with Ditec Fine Cut polish. 
  • For use with (DA) oscillating machines.
  • Provides the user with a pad that has long life, good heat dissipation and workability of polishing product.
  • Can also be used in other combinations, such as with Hologram remover or Medium Cut.
  • Easy Application: Simple spray-and-wipe process for quick and effortless maintenance.
  • Recommended for use in combination with Ditec Fine Cut polish. 
  • For use with (DA) oscillating machines.
  • Provides the user with a pad that has long life, good heat dissipation and workability of polishing product.
  • Can also be used in other combinations, such as with Hologram remover or Medium Cut.
  • Easy Application: Simple spray-and-wipe process for quick and effortless maintenance.

See it in action

Why choose DiTEC Foam Polishing Pads - Fine Cut

DiTEC Foam Polishing Pads 2.0 offer professional-grade results for fine cut corrections and finishing. Their soft foam construction, versatility, and compatibility with modern paint types make them ideal for both professionals and DIY detailers. Achieve a flawless, high-gloss finish with every application.